- Mar 2021
(A) Optical image of the undeformed device (left) and the FEA model for simulation (right). Optical images and max principal strain contours of the multifunctional wearable electronics being uniaxially stretched by 60% along vertical direction (B), along horizontal direction (C), and being biaxially stretched by 30% (D). (E) ECG data of the same device under different deformation modes. Photo credit: Chuanqian Shi, University of Colorado, Boulder.
(A) Model of the device without any stress/strain (left) and Finite element analysis model of the wearable device, not deformed (right). The model to the right exhibits the components inside the device. (B-C) The model shown being stretched 60%, vertically and horizontally respectively, show the maximum strain of the chip being 0.01%. This is much less than the normal failure strain for silicon (1%). (D) This figure shows the FMEA model being stretched 30% vertically and horizontally. The maximum strain in the chip components is below 0.004%. (E) Figure shows sensing performance of device when being stretched using an ECG. No significant effects from the mechanical stretching where evident in the results.